I was curious about this design so google a little to understand what the technical challenges are for these kind of design and found an interesting link:
https://play3r.net/news/press-release/intel-lakefield-3d-stacked-cpu-gives-a-glimpse-of-the-future/
So obviously thermal regulation becomes a huge problem of this design. As a side note I am also very curious how M1 chip is dealing with this issue, but wasn't able to find any info regarding the actual structure of M1..
I was curious about this design so google a little to understand what the technical challenges are for these kind of design and found an interesting link: https://play3r.net/news/press-release/intel-lakefield-3d-stacked-cpu-gives-a-glimpse-of-the-future/ So obviously thermal regulation becomes a huge problem of this design. As a side note I am also very curious how M1 chip is dealing with this issue, but wasn't able to find any info regarding the actual structure of M1..